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Description
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-ÀçÁú :NPP
-DC¼­º¸¸ðÅÍ
-Accuracy: +-1 RPM
-¹«ÇѸ޸ð¸®, ¹«ÇѽºÅÜ
-RPM : 1-12.000 rpm
-µå·¹Àαâ´É
-Acceleration:1-30,000rpm/sec
-¿ÜÇüÄ¡¼ö:spin150
274 (w) x 250 (d) x 451 (h) mm

-¿ÜÇüÄ¡¼ö:spin200
380 (w) x 307 (h) x 559 (d) mm

                       

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~200mm¿þÀÌÆÛ

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Spin150/200 NPP
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Edge Bead Removal
Edge Bead Removal:¹ÝµµÃ¼ Æ÷Åä °øÁ¤Áß ¿þÀÌÆÛ À§¿¡
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-µð½ºÆæ½Ì¼¼Æ®(EBR¿ë):
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ÀçÁú :NPP
DC¼­º¸¸ðÅÍ
Accuracy: +-1 RPM
¹«ÇѸ޸ð¸®, ¹«ÇѽºÅÜ
RPM : 1-12.000 rpm
µå·¹Àαâ´É

¿ÜÇüÄ¡¼ö:spin150
274 (w) x 250 (d) x 451 (h) mm

¿ÜÇüÄ¡¼ö:spin200
380 (w) x 307 (h) x 559 (d) mm

~150mm¿þÀÌÆÛ

 

~200mm¿þÀÌÆÛ

Űº¸µå ºÐ¸® °¡´É

Spin150/200 NPP
+µð½ºÆæ½Ì¼¼Æ®(EBR¿ë)

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Å×ÇÃ·ÐÆ©ºê+³ëÁñ+ ÄÜÆ®·Ñ·¯
+¼®¹é¹ëºê+°¡¾Ðº£½½ ·Î ±¸¼º

ÀçÁú :NPP
DC¼­º¸¸ðÅÍ
Accuracy: +-1 RPM
¹«ÇѸ޸ð¸®, ¹«ÇѽºÅÜ
RPM : 1-12.000 rpm
µå·¹Àαâ´É

¿ÜÇüÄ¡¼ö:spin150
274 (w) x 250 (d) x 451 (h) mm

¿ÜÇüÄ¡¼ö:spin200
380 (w) x 307 (h) x 559 (d) mm

~150mm¿þÀÌÆÛ

 

~200mm¿þÀÌÆÛ

Űº¸µå ºÐ¸® °¡´É

Spin150/200 NPP +µð½ºÆæ½Ì¼¼Æ®(µðº§·ÎÇοë)

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½ºÇÉ¿¡Äª:½ºÇÉÄÚÅ͸¦ ÀÌ¿ëÇÑ ¿¡Äª°øÁ¤-µð½ºÆæ½Ì¼¼Æ®(¿¡Äª¿ë):
Å×ÇÃ·ÐÆ©ºê+³ëÁñ+ ÄÜÆ®·Ñ·¯
+¼®¹é¹ëºê+°¡¾Ðº£½½ ·Î ±¸¼º

ÀçÁú :NPP
DC¼­º¸¸ðÅÍ
Accuracy: +-1 RPM
¹«ÇѸ޸ð¸®, ¹«ÇѽºÅÜ
RPM : 1-12.000 rpm
µå·¹Àαâ´É

¿ÜÇüÄ¡¼ö:spin150
274 (w) x 250 (d) x 451 (h) mm

¿ÜÇüÄ¡¼ö:spin200
380 (w) x 307 (h) x 559 (d) mm

~150mm¿þÀÌÆÛ

 

~200mm¿þÀÌÆÛ

Űº¸µå ºÐ¸® °¡´É

Spin150/200 NPP+µð½ºÆæ½Ì¼¼Æ®(¿¡Äª¿ë)

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-µð½ºÆæ½Ì¼¼Æ®(¸°½Ì¿ë):
Å×ÇÃ·ÐÆ©ºê+³ëÁñ+ ÄÜÆ®·Ñ·¯
·Î ±¸¼º

ÀçÁú :NPP
DC¼­º¸¸ðÅÍ
Accuracy: +-1 RPM
¹«ÇѸ޸ð¸®, ¹«ÇѽºÅÜ
RPM : 1-12.000 rpm
µå·¹Àαâ´É

¿ÜÇüÄ¡¼ö:spin150
274 (w) x 250 (d) x 451 (h) mm

¿ÜÇüÄ¡¼ö:spin200
380 (w) x 307 (h) x 559 (d) mm

~150mm¿þÀÌÆÛ

 

~200mm¿þÀÌÆÛ

Űº¸µå ºÐ¸® °¡´É

Spin150/200 NPP+µð½ºÆæ½Ì¼¼Æ®(¸°½Ì¿ë)

½ºÇÉÇÁ·Î¼¼½Ì
Drying
Rinse/clean
Etching
Developing
-¿ëµµº° ±â´É Ãß°¡¹× Á¦°Å°¡´É-¿ÂµµÁ¶Àý °¡´É-¼¼Á¤, Çö»ó, ¸°½º, µå¶óÀÌ °¡´É
ÀçÁú :Å×Ç÷Р,PVC
ÄɹÌÄà ¼¼Á¤ ¹× ½Ä°¢¿ë
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        Polos Spincoater ÀÛµ¿¸ð½À

  • Determination of spincoating uniformity and wafer to wafer uniformity of the APT Spincoating system using AZ5214E resist.
    ( By: T. Zijlstra TUDelft B. de Lange TUDelft B. van Weelde SPS )

    - APT SpincoaterÀÇ Æ¯Â¡
    Wafer uniformityÀÇ Çâ»óÀ» À§ÇÑ 2 Point

    1. acceleration during ramp up: Changing the acceleration resulted in more smooth resist films,
    i.e. ¡°comet¡± tails disappeared when the acceleration during ramp up was increased to 1000 rpm per second, with a final spinning speed of 5000 rpm.

    2. Airflow in the spinbowl: Reducing the the airflow to zero resulted in circular uniformal resist pattern on the wafer

납품현황:ETRI,µ¿¿ìÈ­ÀÎÄ·,¿Ü ´Ù¼ö ±â¾÷ ¹× ¿¬±¸¼Ò

 

Mask Cleaner

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ALD System(Atomic Layer Deposition)

espro Flowmeter

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