JS-12EDR

Full 플래스틱 하우징

Single wafer process, 6~12inch

Manual loading and unloading system

Acid-resistant materials and structure

Time : 1-999 sec/step

Speed :1-2.000 rpm

Non contact wafer chuck or mechanical Chuck

Etch uniformity: + - 3%

2-6 chemicals, DIW rinse and N2 dry

Substrate Front & Back Side In Situ Di Water Rinse

Temperature control for chemicals

Chemical flow control

Spray swing arm movement(Option)

스핀클리닝, 스핀 드라잉,스핀에칭, 스핀 디스펜싱

이지 LCD control:

-시간 :0-999sec/step

-RPM:0-2000

-Valve선택

 

1600Wx1000Dx1800H mm