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Key features
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-Adjustable writing field and resolution with exchangeable objectives
Compatible with CAD files or bitmap images
Compatible with g-line photoresists
Compatible with a wide range of substrates (silicon, glass, metal, plastic, ... )
Compatible with any sample size up to 4¡± wafer Camera feedback for alignment steps
Key benefits
Time and money saving due to the absence of a hard-mask
lntuitive alignment method with direct overlay of the design on the sample
Table-top with very small foot print
Technology well suited for microelectronics, 2D-materials, microfluidics, optoelectronics, opties or any other 2D microfabrication application |