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    JS-MSP Magnetron Sputter
    Series

  • °­ÇÑ ÀÚ±âÀå¿¡ ÀÇÇÑ °í¹Ðµµ ÇöóÁ ½ºÆÛÅ͸µ ¼Ò½º¸¦ ÀÌ¿ëÇÏ¿© ³·Àº °¡½º¾Ð·Â¿¡¼­ »ê¼Ò¿¡ ¿µÇâ°ú ÇöóÁ¿¡ ÀÇÇÑ ¼Õ»óÀÌ ¾ø´Â °í¼øµµ±Ý¼Ó, »ï¿ø°è ±Ý¼Ó ¹× ÀüµµÃ¼ ¹Ú¸· Áø°ø ÁõÂøÀÌ °¡´É.
  • Æí¸®ÇÑ ÀÛµ¿¹æ½Ä
  • PLC ¼ÒÇÁÆ®¿þ¾î Á¦¾î
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  • µ¥½ºÅ©Å¾ »çÀÌÁîÀÇ ¼ÒÇü À¸·Î ¼³Ä¡°ø°£ ÃÖ¼ÒÈ­
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JS-MSP4

JS-MSP41

Magnetron Sputter(3¡± gun x 1),¿É¼ÇÀ¸·Î ½ºÆÛÅÍ°Ç ¼ö·® ¼±Åà °¡´É

¼º´É ¹× »ç¾ç
- ÁõÂø±âÆÇÅ©±â : Á¶°¢½ÃÆí~4 ÀÎÄ¡ ¿þÀÌÆÛ
- ·¹¼­ÇÇ¿¡ ÀÇÇÑ ÀÚµ¿ÁõÂø °øÁ¤ Á¦¾î,ÀúÀå
- Magnetron sputtering source : 3¡± gun(¿É¼Ç:1set,2set,3set)
- Ultimate pressure :
Below than 5 x 10E-7 torr @ 12½Ã°£ À̳»
- Deposition uniformity : ¡¾3% À̳» @ 4 inch dia sample, STD Dep.
- ROR : 1 x 10E-6 torr/min ÀÌÇÏ
- Substrate Ç¥¸é¿Âµµ : Up to 500¡É
- ±âÆǿµµ±ÕÀϵµ : ¡¾3¡É À̳» @ 4 inch zone
- Sputtering source bias volatge: -200V ÀÌ»ó

 

Magnetron Sputter(3¡± gun x 1) ±Ô°Ý¼­ Magnetron Sputter(3¡± gun x 2) ±Ô°Ý¼­  

¡á Ư¡
- °­ÇÑ ÀÚ±âÀå¿¡ ÀÇÇÑ °í¹Ðµµ ÇöóÁ ½ºÆÛÅ͸µ ¼Ò½º¸¦ ÀÌ¿ëÇÏ¿© ³·Àº °¡½º¾Ð·Â¿¡¼­ »ê¼Ò¿¡ ¿µÇâ°ú ÇöóÁ¿¡ ÀÇÇÑ ¼Õ»óÀÌ ¾ø´Â °í¼øµµ±Ý¼Ó, »ï¿ø°è ±Ý¼Ó ¹× ÀüµµÃ¼ ¹Ú¸· Áø°ø ÁõÂøÀÌ °¡´ÉÇÔ.

¡á ±Ô°Ý
(1). ¼º´É ¹× »ç¾ç
- ÁõÂø±âÆÇÅ©±â : Á¶°¢½ÃÆí~4 ÀÎÄ¡ ¿þÀÌÆÛ
- ·¹¼­ÇÇ¿¡ ÀÇÇÑ ÀÚµ¿ÁõÂø °øÁ¤ Á¦¾î,ÀúÀå
- Magnetron sputtering source : 1 set, 3¡± gun
- Ultimate pressure :
Below than 5 x 10E-7 torr @ 12½Ã°£ À̳»
- Deposition uniformity : ¡¾3% À̳» @ 4 inch dia sample, STD Dep.
- ROR : 1 x 10E-6 torr/min ÀÌÇÏ
- Substrate Ç¥¸é¿Âµµ : Up to 500¡É
- ±âÆǿµµ±ÕÀϵµ : ¡¾3¡É À̳» @ 4 inch zone
- Sputtering source bias volatge: -200V ÀÌ»ó
(2). ÁÖ¿ä ÀÚÀç ¹× ¼³ºñ
- °øÁ¤Ã¨¹ö(SUS304)
. Top door, ½Ãâ, ³»ºÎ½¯µåÄ«¹Ù,ÀüÇØ¿¬¸¶
All port UHV
ISO seal & down sputter design
- °øÁ¤Ã¨¹ö Áø°ø¹è±âÀåÄ¡
. Turbo pump (450 l/s(N2), <5x10E-8torr)
. Backing pump (600 l/m ÀÌ»ó, No tip-seal replacement, air cooling)
. Gate valve (metal bonnet)
. Turbulence free pumping and vent
- ±âÆÇÀåÄ¡
. 4ÀÎÄ¡ ¿þÀÌÆÛ 1Àå
. °ø¾Ð¼ÅÅÍ ±â´É
. Heating element : UHV compotible
. °í¿Â¿ë È÷ÅÍ : Up to 500¡É
- °íÁø°ø ¹× ÀúÁø°ø ÃøÁ¤ÀåÄ¡
. Wide range vacuum transducer
. Automatic filament control, set point relay
- Magnetron sputtering source : 1 set, 3¡±
. Directly cooled target
. Max.DC power : 1,000W
. NdFeB encapsulated, CTFE insulator
. Pneumatic shutter
. Size & Q¡¯ty : 3 inch x 1ea
- Gas supply
. 2 MFC (Ar, O2)
. Response time : <50 micro seconds
. ¾ÈÀü±â´É ÀÚüÇÁ·Î±×·¥ ³»Àå :
¾ÆÅ©ÀνÄÄ«¿îÅÍ, ³»ºÎ¿Âµµ °ú¿­Â÷´Ü, ºñÁ¤»óÀü·ù
Àü¾ÐÃâ·Â ÀÎÅͶô Â÷´Ü °­Á¦Á¾·á, ¿¡·¯¸Þ¼¼ÁöÀúÀå
. Multi-source select controller
- Auto pressure control unit
. Down stream
. Pressure control : 1mtorr ~ 50mtorr
- ÇÁ·¹ÀÓ
. AL, Foot & caster
. 19" Standard Rack cabinet
- ½Ã½ºÅÛÁ¦¾îÀåÄ¡
. »ê¾÷¿ë ÅÍÄ¡ Monitor ( 10 inch ÀÌ»ó)
. Programming : Data log./real or historical
trend, Recipe selection, Temp. control and
monitor, Pressure monitoring, Cycle process
function, Partial running function,
Safety alarm,
.PLC Module (High speed, noise isolation)
- À¯Æ¿¸®Æ¼ ¾ÈÀü ÀÎÅͶô Á¦¾î ½Ã½ºÅÛ

- EMO


¡á Ư ¡
- °­ÇÑ ÀÚ±âÀå¿¡ ÀÇÇÑ °í¹Ðµµ ÇöóÁ ½ºÆÛÅ͸µ ¼Ò½º¸¦ ÀÌ¿ëÇÏ¿© ³·Àº °¡½º¾Ð·Â¿¡¼­ »ê¼Ò¿¡ ¿µÇâ°ú ÇöóÁ¿¡ ÀÇÇÑ ¼Õ»óÀÌ ¾ø´Â °í¼øµµ±Ý¼Ó, »ï¿ø°è ±Ý¼Ó ¹× ÀüµµÃ¼ ¹Ú¸· Áø°ø ÁõÂøÀÌ °¡´ÉÇÔ.

¡á ±Ô °Ý
(1). ¼º´É ¹× »ç¾ç
- ÁõÂø±âÆÇÅ©±â : Á¶°¢½ÃÆí~4 ÀÎÄ¡ ¿þÀÌÆÛ
- ·¹¼­ÇÇ¿¡ ÀÇÇÑ ÀÚµ¿ÁõÂø °øÁ¤ Á¦¾î,ÀúÀå
- Magnetron sputtering source : 2 set, 3¡± gun
- Ultimate pressure :
Below than 5 x 10E-7 torr @ 12½Ã°£ À̳»
- Deposition uniformity : ¡¾3% À̳» @ 4 inch dia sample, STD Dep.
- ROR : 1 x 10E-6 torr/min ÀÌÇÏ
- Substrate Ç¥¸é¿Âµµ : Up to 500¡É
- ±âÆǿµµ±ÕÀϵµ : ¡¾3¡É À̳» @ 4 inch zone
- Sputtering source bias volatge: -200V ÀÌ»ó
(2). ÁÖ¿ä ÀÚÀç ¹× ¼³ºñ
- °øÁ¤Ã¨¹ö(SUS304)
. Top door, ½Ãâ, ³»ºÎ½¯µåÄ«¹Ù,ÀüÇØ¿¬¸¶
All port UHV
ISO seal & down sputter design
- °øÁ¤Ã¨¹ö Áø°ø¹è±âÀåÄ¡
. Turbo pump (450 l/s(N2), <5x10E-8torr)
. Backing pump (600 l/m ÀÌ»ó, No tip-seal replacement, air cooling)
. Gate valve (metal bonnet)
. Turbulence free pumping and vent
- ±âÆÇÀåÄ¡
. 4ÀÎÄ¡ ¿þÀÌÆÛ 1Àå
. °ø¾Ð¼ÅÅÍ ±â´É
. Heating element : UHV compotible
. °í¿Â¿ë È÷ÅÍ : Up to 500¡É
. Substrate rotation; 10~50RPM
- °íÁø°ø ¹× ÀúÁø°ø ÃøÁ¤ÀåÄ¡
. Wide range vacuum transducer
. Automatic filament control, set point relay
- Magnetron sputtering source : 2 set, 3¡±
. Directly cooled target
. Max. DC power : 1,000W
. Max. RF power : 300W
. NdFeB encapsulated, CTFE insulator
. Pneumatic shutter
. Size & Q¡¯ty : 3 inch x 2ea
- Gas supply
. 2 MFC (Ar, O2)
. Response time : <50 micro seconds
. ¾ÈÀü±â´É ÀÚüÇÁ·Î±×·¥ ³»Àå :
¾ÆÅ©ÀνÄÄ«¿îÅÍ, ³»ºÎ¿Âµµ °ú¿­Â÷´Ü, ºñÁ¤»óÀü·ù
Àü¾ÐÃâ·Â ÀÎÅͶô Â÷´Ü °­Á¦Á¾·á, ¿¡·¯¸Þ¼¼ÁöÀúÀå
. Multi-source select controller
- Auto pressure control unit
. Down stream
. Pressure control : 1mtorr ~ 50mtorr
- ÇÁ·¹ÀÓ
. AL, Foot & caster
. 19" Standard Rack cabinet
- ½Ã½ºÅÛÁ¦¾îÀåÄ¡
. »ê¾÷¿ë ÅÍÄ¡ Monitor ( 10 inch ÀÌ»ó)
. Programming : Data log./real or historical
trend, Recipe selection, Temp. control and
monitor, Pressure monitoring, Cycle process
function, Partial running function,
Safety alarm,
.PLC Module (High speed, noise isolation)
- À¯Æ¿¸®Æ¼ ¾ÈÀü ÀÎÅͶô Á¦¾î ½Ã½ºÅÛ
- EMO

 
     

¸¶±×³×Æ®·Ð ½ºÆÛÅ͸µ Àåºñ´Â Å©°Ô è¹ö, Áø°ø¹è±â, ÇöóÁ¹ß»ýºÎºÐ, Á¦¾îºÎºÐ, À¯Æ¿¸®Æ¼ºÎºÐÀÇ
´Ù¼¸ ºÎºÐÀ¸·Î ±¸ºÐµÉ ¼ö ÀÖ´Ù.

è¹öÀÇ ³»ºÎ¸¦ Áø°øÆßÇÁ·Î 10-£µtorr(´ë±â¾ÐÀº 760torr) ÀÌÇÏ·Î ¹è±âÇÏ°í °¡½º(Ar, O2, N2 µî)¸¦
ÁÖÀÔÇؼ­ 10-2~10-3torr ¾Ð·ÂÀ» À¯ÁöÇÑ´Ù.


Ÿ°ÙÀÇ »óºÎ¿¡´Â ¸¶±×³Ý¿¡ ÀÇÇؼ­ ÀÚ±â·Â¼±°ú Ÿ°Ù¿¡ À½(£­) Àü¾ÐÀΰ¡¿¡ ÀÇÇØ Å¸°Ù »óºÎ¿¡ ÇöóÁ°¡ Çü¼ºµÇ°í.

ÇöóÁ¿¡ ÀÇÇؼ­ ¿¡³ÊÁö¸¦ °®´Â ¿øÀÚ È¤Àº ºÐÀÚ µîÀÇ ÀÌ¿ÂÀÌ Å¸°Ù¿¡ Ãæµ¹ÇϹǷΠÀÔÀÚ°¡

¹æÃâµÇ¾î ±âÆÇ¿¡ ºÎÂøµÈ´Ù£®


ÀϹÝÀûÀ¸·Î Á¦À۵Ǵ ¹Ú¸·ÀÇ µÎ²²´Â 1¥ìmÀÌÇÏÀÌ¸ç ½ºÆÛÅ͸µ µÇ´Â ³ª³ë ÀÔÀÚÀÇ Å©±â´Â 0.1~
10nmÀ¸·Î ½ºÆÛÅ͸µ ±â¼úÀº ³ª³ë±â¼ú·Î ºÐ·ùµÈ´Ù.

   
     

 

 

 

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